Category
Glycidyloxypropyltrimethoxysilane Epoxy Silane CAS 2530
Overview CAS 2530-83-8 GLYMO Epoxy Silane Glycidyloxypropyltrimethoxysilane Silano CAS# 2530-83-8 Amino Silane, equivale
Overview
CAS# 2530-83-8
Amino Silane, equivalent to GLYMO, A187, Z6040, KBM403, GF31Product Parameters
Packaging & ShippingCompany Profile
- HENGDA Chemical was established in 1965, we are the first silane coupling agent manufacturer in China.
- Owns 2 plants in Gaizhou and Weifang city separately.
- ISO 9001 certified company
- DCS automotive control; SIS, waste water & gas treatment control systerm
Our Advantages
Basic Info.
Model NO. | HENGDA-M3133 |
Industries | Coatings, Fiberglass, Resins, Adhesives Sealants |
Trade Name | Hengda-M3133 |
Goods Ready Time | Within 7days |
Reach | Yes |
Transport Package | Drum, IBC Tote |
Specification | 99%min |
Trademark | HENGDA |
Origin | China |
Production Capacity | 12000mt/Year |
Product Description
CAS 2530-83-8 GLYMO Epoxy Silane Glycidyloxypropyltrimethoxysilane SilanoCAS# 2530-83-8
Amino Silane, equivalent to GLYMO, A187, Z6040, KBM403, GF31Product Parameters
Appearance | colorless transparent liquid |
Purity | ≥98%; ≥99% |
Density (ρ20), g/cm3 | 1.060-1.080 |
Molecular Weight | 236.34 |
Refractive Index (n25D) | 1.4220-1.4320 |
- HENGDA Chemical was established in 1965, we are the first silane coupling agent manufacturer in China.
- Owns 2 plants in Gaizhou and Weifang city separately.
- ISO 9001 certified company
- DCS automotive control; SIS, waste water & gas treatment control systerm
Our Advantages
- Extensive production and technical experience from long manufacturing history since 1965.
- Combining upstream & down stream, low cost makes competitive price
- Stable quality, Fast shipping, High effeciency service responce
- REACH available
- It is used in the production process of fiberglass, as a size ingredient.
- It is used as an additive to polyurethane resins used in foundry.
- It is used in polysulfides and polyurethanes, epoxy resin adhesive, filled or reinforced thermoset resins, fiberglass adhesive and inorganic-filled or glass-reinforced thermoplastic resins etc.
- It is used to enhance the electrical performance of epoxy-based electronic sealants and packaging materials and printed circuit boards, improving the bond between the resin and the matrix or filler.
- It is used in a wide range of fillers and matrices, including clay, talc, wollastonite, silica, quartz or metals such as aluminium, copper and iron.